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gp2s27j0000f series 1 sheet no.: d3-a01901en date oct. 3. 2005 ? sharp corporation notice the content of data sheet is subject to change without prior notice. in the absence of con rmation by device speci cation sheets, sharp takes no responsibility for any defects that may occur in equipment using any sharp devices shown in catalogs, data books, etc. contact sharp in order to obtain the latest device speci cation sheets before using any sharp device. gp2s27j0000f series smt, detecting distance : 0.7mm phototransistor output, compact re ective photointerrupter description gp2s27j0000f series is a compact-package, photo- transistor output, re ective photointerrupter, with emitter and detector facing the same direction in a molding that provides non-contact sensing. the compact package series is a result of unique technology, combing transfer and injection molding, that also blocks visible light to minimize false detection. this photointerrupter can be ordered in different ctr ranks, and comes in a surface-mount, gullwing lead package, suitable for re ow soldering. features 1. re ective with phototransistor output 2. highlights : ? compact size ? surface mount type (smt), reflow soldering, with gullwing leads ? optional tape and reel (t&r) 1 000 pcs per reel 3. key parameters : ? optimal sensing distance : 0.7mm ? package : 4 3 1.7mm ? visible light cut resin to prevent 4. lead free and rohs directive compliant agency approvals/compliance 1. compliant with rohs directive applications 1. detection of object presence or motion. 2. example : printer, optical storage
2 sheet no.: d3-a01901en gp2s27j0000f series + 0.2 ? + 0.2 ? + 0.2 ?
3 sheet no.: d3-a01901en gp2s27j0000f series date code (symbol) january july february august march september april october may november june december rank mark there is no rank indicator. country of origin japan
4 sheet no.: d3-a01901en gp2s27j0000f series (t a = 25 ? c) parameter symbol rating unit input forward current i f 50 ma reverse voltage v r 6v power dissipation p 75 mw output collector-emitter voltage v ceo 35 v emitter-collector voltage v eco 6v collector current i c 20 ma collector power dissipation p c 75 mw total power dissipation p tot 100 mw operating temperature t opr ? 25 to + 85 ? c storage temperature t stg ? 40 to + 100 ? c ? 1 soldering temperature t sol 260 ? c ? 1 for 5s or less (t a = 25 ? c) parameter symbol condition min. typ. max. unit input forward voltage v f i f = 20ma ? 1.2 1.4 v reverse current i r v r = 6v ?? 10 a output collector dark current i ceo v ce = 20v ? 1 100 na transfer charac- teristics ? 2 collector current i c i f = 4ma, v ce = 2v 20 45 120 a response time rise time t r v ce = 2v, i c = 100 a, r l = 1k , d = 1mm ? 20 100 s fall time t f ? 20 100 ? 3 leak current i leak i f = 4ma, v ce = 2v ?? 100 na ? 2 the condition and arrangement of the re ective object are shown below. the rank splitting of collector current (i c ) shall be executed according to the table below. rank collector current, i c [ a] (i f = 4ma, v ce = 2v) package oleeve color a 20 to 42 yellow b 34 to 71 transparent c 58 to 120 green ? 3 without re ective object. 0.5mm 0.5mm soldering area: the hatched area more than 0.5mm away from the lower edge of package as shown in the gure below. = 1mm glass plate al evaporation
5 sheet no.: d3-a01901en gp2s27j0000f series package sleeve taping rank collector current i c [ a] (i f = 4ma, v ce = 2v, t a = 25 ? c) 50 pcs/sleeve 1 000 pcs/reel model no gp2s27j0000f GP2S27TJ000F a, b or c 20 to 120 gp2s27bj000f gp2s27t2j00f b 34 to 71 gp2s27cj000f gp2s27t3j00f c 58 to 120 gp2s27abj00f gp2s27t5j00f a or b 20 to 71 gp2s27bcj00f gp2s27t6j00f b or c 34 to 120 ? the ratio of each rank can not be guaranteed. please contact a local sharp sales representative to see the actial status of the produiction.
6 sheet no.: d3-a01901en gp2s27j0000f series fig.5 collector current vs. collector-emitter voltage fig.6 relative collector current vs. ambient temperature fig.3 forward current vs. forward voltage fig.4 collector current vs. forward current 0 0.5 1 1.5 2 2.5 3 1 10 100 25 ? c 0 ? c 50 ? c ? 25 ? c t a = 75 ? c forward current i f (ma) forward voltage v f ( v ) 51015 2530 0 0 100 200 300 400 500 600 700 20 collector current i c ( a) forward current i f ( ma ) v ce = 2v t a = 25 ? c 246810 0 0 50 100 150 200 250 300 350 12 4ma 2ma 7ma 10ma i f =15ma collector current i c ( a) collector-emitter voltage v ce ( v ) t a = 25 ? c relative collector current i c (%) ambient temperature t a ( ? c ) 025 ? 25 0 20 40 60 80 100 120 50 100 75 i f =4ma v ce =2v fig.1 forward current vs. ambient temperature fig.2 power dissipation vs. ambient temperature 025 0 20 15 40 60 120 50 100 75 80 75 100 85 p tot p, p c power dissipation p (mw) ambient temperature t a ( ? c ) ? 25 ? 25 0 25 50 75 100 85 forward current i f (ma) ambient temperature t a ( ? c ) 60 50 40 30 20 10 0
7 sheet no.: d3-a01901en gp2s27j0000f series fig.7 collector dark current vs. ambient temperature fig.8 response time vs. load resistance fig.9 test circuit for response time fig.10 relative collector current vs. distance (reference value) fig.11 detecting position characteristics (1) fig.12 detecting position characteristics (2) collector dark current i ceo (a) ambient temperature t a ( ? c ) 75 100 50 25 0 10 ? 10 10 ? 9 10 ? 8 10 ? 7 10 ? 6 v ce = 20v input output output input r d r l v cc t d t r t s t f 90% 10% reflector plate response time ( s) load resistance r l ( k ) 0.1 1 10 100 1 000 0.1 1 10 100 1 000 v ce = 2v i c = 100 a t a = 25 ? c t r t f t d t s relative collector current (%) card moving distance l ( mm ) 0 ? 1 ? 224 80 100 40 60 20 0 6 1357 d=1mm v ce =2v i f =4ma t a =25 ? c relative collector current (%) card moving distance l ( mm ) ? 2 ? 3024 80 100 40 60 20 0 6 ? 11 3 5 d=1mm i f =4ma v ce =2v t a =25 ? c relative collector current (%) distance between sensor and al evaporation glass d ( mm ) 012 45 80 100 40 60 20 0 3 i f = 4ma v ce = 2v t a = 25 ? c
8 sheet no.: d3-a01901en gp2s27j0000f series fig.13 test condition for distance & detecting position characteristics fig.14 freauency response fig.15 spectral sensitivity (detecting side) al evaporated glass d correspond to fig.11 oms card l = 0 d ? = 1mm + + d = 1mm test condition 1mm white ? = 0 oms card correspond to fig.12 black black v ce = 2v i f = 4ma v ce = 2v i f = 4ma correspond to fig.10 relative sensitivity (%) wavelength ( nm ) 600 700 800 900 1 000 1 200 80 100 40 60 20 0 1 100 t a = 25 ? c voltage gain a v (db) frequency f ( hz ) ? 20 ? 15 ? 10 ? 5 0 5 1k r l = 10k v ce =2v i c =100 a t a =25 ? c 10 2 10 3 10 4 10 5 10 6 remarks : please be aware that all data in the graph are just for reference and not for guarantee.
9 sheet no.: d3-a01901en gp2s27j0000f series category material maximum sensitivity wavelength (nm) sensitivity wavelength (nm) response time ( s) phototransister silicon (si) 930 700 to 1 200 20 ? photo emitter (qty. : 1) category material maximum light emitting wavelength (nm) i/o frequency (mhz) infrared emitting diode (non-coherent) gallium arsenide (gaas) 950 0.3 ? material case lead frame lead frame plating black polyphenylene sul de resin 42alloy sncu plating
10 sheet no.: d3-a01901en gp2s27j0000f series ? c, storage humidity : 70%rh or less at regular packaging. treatment after opening the moisture-proof package after opening, you should mount the products while keeping them on the condition of 5 to 25 ? c and 70%rh or less in humidity within 4 days. after opening the bag once even if the prolonged storage is necessary, you should mount the products within two weeks. and when you store the rest of products you should put into a dry box. otherwise after the rest of products and silicagel are sealed up again, you should keep them under the condition of 5 to 30 ? c and 70%rh or less in humidity. baking before mounting when the above-mentioned storage method could not be executed, please process the baking treatment before mounting the products. however the baking treatment is permitted within one time. recommended condition : 125 ? c, 16 to 24 hours ? x temporarily the products to substrate. ow soldering: re ow soldering should follow the temperature pro le shown below. soldering should not exceed the curve of temperature pro le and time. please solder within one time. max 240 ? c max 160 ? c 200 ? c 25 ? c 1 to 4 ? c/s max120s max10s max60s max90s 1 to 4 ? c/s 1 to 4 ? c/s
11 sheet no.: d3-a01901en gp2s27j0000f series other notice please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and pcb varies depending on the cooling and soldering conditions. lead pin lead terminals of this product are tin copper alloy plated. before usage, please evaluate solderability with actual conditions and con rm. and the uniformity in color for the lead terminals are not speci ed. ? c or below. immersion time should be 3 minutes or less. ultrasonic cleaning : do not execute ultrasonic cleaning. recommended solvent materials : ethyl alcohol, methyl alcohol and isopropyl alcohol. c brominated ame retardants such as the pbbos and pbbs are not used in this product at all. this product shall not contain the following materials banned in the rohs directive (2002/95/ec). ?lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (pbb), polybrominated diphenyl ethers (pbde).
12 sheet no.: d3-a01901en gp2s27j0000f series cation cation is distinguished by the color of the sleeve as shown in the table below. but the ratio of each rank can not be guaranteed. rank color of sleeve a yellow b transparent c green
13 sheet no.: d3-a01901en gp2s27j0000f series carrier tape structure and dimensions reel structure and dimensions direction of product insertion [packing : 1 000pcs/reel] storage method storage conditions should follow the condition shown below. storage temperature : 5 to 30 ? c storage hunidity : 70%rh or less f g j e k c i a d b i h m 5 ? max. dimensions list (unit : mm) a 12 0.3 c 5.5 0.05 d 1.75 0.1 e 8 0.1 h 1.5 + 0.1 ? 0 i 4.4 0.1 j 0.3 0.05 k 2 0.1 l 5.2 0.1 m 1.6 + 0.1 ? 0 f 2 0.05 g 4 0.1 b 7.6 + 0.3 ? 0 a c e g d dimensions list (unit : mm) a 180 b 13 0.8 c 60 + 0.5 ? 0 d 13 0.2 e 21 0.8 f 15.4 1 g 2 + 0.3 ? 0 f b pull-out direction
14 sheet no.: d3-a01901en gp2s27j0000f series cations, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. manufacturing locations are also subject to change without notice. ?observe the following points when using any devices in this publication. sharp takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used speci ed in the relevant speci cation sheet nor meet the following conditions: (i) the devices in this publication are designed for use in general electronic equipment designs such as: --- personal computers --- of ce automation equipment --- telecommunication equipment [terminal] --- test and measurement equipment --- industrial control --- audio visual equipment --- consumer electronics (ii) measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when sharp devices are used for or in connection with equipment that requires higher reliability such as: --- transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- traf c signals --- gas leakage sensor breakers --- alarm equipment --- various safety devices, etc. (iii) sharp devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- space applications --- telecommunication equipment [trunk lines] --- nuclear power control equipment --- medical and other life support equipment (e.g., scuba). ?if the sharp devices listed in this publication fall within the scope of strategic products described in the foreign exchange and foreign trade law of japan, it is necessary to obtain approval to export such sharp devices. ?this publication is the proprietary product of sharp and is copyrighted, with all rights reserved. under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of sharp. express written permission is also required before any use of this publication may be made by a third party. ?contact and consult with a sharp representative if there are any questions about the contents of this publication. [h144]

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